Investigation of optical properties of silicon oxynitride films deposited by RF PECVD method

被引:11
|
作者
Kijaszek, Wojciech [1 ]
Oleszkiewicz, Waldemar [1 ]
Zakrzewski, Adrian [2 ]
Patela, Sergiusz [2 ]
Tlaczala, Marek [1 ]
机构
[1] Wroclaw Univ Sci & Technol, Fac Microsyst Elect & Photon, Div Microelect & Nanotechnol, Janiszewskiego 11-17, PL-50372 Wroclaw, Poland
[2] Wroclaw Univ Sci & Technol, Fac Microsyst Elect & Photon, Div Microsyst & Photon, Janiszewskiego 11-17, PL-50372 Wroclaw, Poland
来源
MATERIALS SCIENCE-POLAND | 2016年 / 34卷 / 04期
关键词
silicon oxynitride; RF PECVD; spectroscopic ellipsometry; reflection coefficient; MECHANICAL-PROPERTIES; THIN-FILMS;
D O I
10.1515/msp-2016-0111
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this study, the authors deposited silicon oxynitride films by Radio Frequency Plasma Enhanced Chemical Vapour Deposition (RF PECVD) method. The research explores the relationship between the deposition process parameters and the optical properties of the deposited SiOxNy films. The optical constants of SiOxNy films were measured and calculated by spectroscopic ellipsometry method. Additionally, the authors investigated the possibility of controlling the deposited film composition by the flow ratio of different gaseous precursors: ammonia (NH3), diluted silane (2% SiH4/98% N-2), nitrous oxide (N2O) and nitrogen (N-2). The gas mixture introduced to the working chamber during the growth of the film has the influence on the Si-O and Si-N bonds formation and the ratio between these bonds determines the refractive index of the deposited film.
引用
收藏
页码:868 / 871
页数:4
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