Characterization of a burn-in failure caused by a defective source driver on TFT-LCD panel

被引:0
|
作者
Wang, Fred S. C. [1 ]
Lin, Keh-La [1 ]
Tso, Ko-Yang [1 ]
Chao, Chin-Chieh [1 ]
Wang, Wai William [1 ]
Yu, Alan [1 ]
Lee, C. Y. [1 ]
Kuo, Chien Hung [1 ]
Wang, C. W. Arex [2 ]
Chiu, Yi [3 ]
机构
[1] Raydium Semicond Corp, 2nd Floor 1,Sec 2,Li Hsin Rd,Hsin Chu Sci Pk, Hsinchu 300, Taiwan
[2] AU Optron Corp, Adv Technol Ctr, Hsinchu 300, Taiwan
[3] Natl Chiao Tung Univ, Dept Elect & Control Engn, Hsinchu 300, Taiwan
来源
IPFA 2006: PROCEEDINGS OF THE 13TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS | 2006年
关键词
bit-line defect; CP; COG; TFT-LCD; LCD driver; source driver; DVS; EMMI; EDAX; two-step DAC; ATE;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes a thorough investigation to identify the root cause of an LCD panel bum-in failure induced by an LCD source driver, which is observed in a large-scale LCD factory producing more than one million LCD panels per month. The investigation demonstrates the effectiveness of the circuit simulation to precisely locate the defective spot which is caused by a metal slice originated from outer rings of an LCD COG (chip-on-glass) source driver. With the aid of emission microscope (EMMI), Energy Dispersive Analysis X-Ray (EDAX), and Chip Probing (CP) tester, the root cause of the failure is well explained. The formation mechanism of metal slice from the outer rings is thoroughly studied. A solution to completely eliminate the source of metal slices from the outer rings during wafer processing is also proposed.
引用
收藏
页码:171 / +
页数:2
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