Effect of Si on the Composite Interface Microstructure and Properties of Cu/Al Cold-rolling Cladding

被引:0
|
作者
Chang Dongxu [1 ]
Wang Ping [1 ]
Gong Xiaoyu [1 ]
Wang Zeyu [1 ]
Miao Long [1 ]
Li Baomian [1 ]
机构
[1] Northeastern Univ, Key Lab Minist Educ Electromagnet Proc Mat, Shenyang 110004, Peoples R China
关键词
cold-rolling cladding; Al-Si alloy; interface; compounds; properties; MECHANICAL-PROPERTIES;
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Influence of alloying element silicon on the thickness of interface diffusion, the recrystallized structures, the interface bonding strength, the microhardness of the matrix and interface for Cu/Al clod-rolling cladding in a heat treatment condition was investigated by measuring and observing the mechanical properties and microstructures of the composite interface. The results show that silicon is able to discourage the diffusion of Cu and Al atoms, control the growth of metallic compounds between Cu and Al, refine the grains and increase the microhardness of aluminium matrix. But silicon decreases the interface bonding strength at high heat treatment temperature for a long holding time.
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页码:2216 / 2221
页数:6
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