Assembly of Mechanically Compliant Interfaces between Optical Fibers and Nanophotonic Chips

被引:0
|
作者
Barwicz, Tymon [1 ]
Taira, Yoichi [2 ]
Numata, Hidetoshi [2 ]
Boyer, Nicolas [3 ]
Harel, Stephane [3 ]
Kamlapurkar, Swetha [1 ]
Takenobu, Shotaro [4 ]
Laflamme, Simon [3 ]
Engelmann, Sebastian [1 ]
Vlasov, Yurii [1 ]
Fortier, Paul [3 ]
机构
[1] IBM TJ Watson Res Ctr, Yorktown Hts, NY 10598 USA
[2] IBM Res Tokyo, Saiwai Ku, Kawasaki, Kanagawa 2120032, Japan
[3] IBM Bromont, Bromont, PQ J2L 1A3, Canada
[4] Asahi Glass Co Ltd, AGC Elect, Div Gen Technol, Kanagawa Ku, Yokohama, Kanagawa 2218755, Japan
来源
2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2014年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Silicon nanophotonics may bring disruptive advances to datacom, telecom, and high performance computing. However, the deployment of this technology is hampered by the difficulty of cost efficient optical inputs and outputs. To address this challenge, we have recently proposed a low- cost, mechanically compliant polymer interface between standard single mode fibers and nanophotonic waveguides. Our concept promises better mechanical reliability and better optical performance than existing technology. To manage the cost of assembly, we show here that self- alignment features can be effectively used to bridge the gap between the accuracy required by single-mode optics (1-2 um) and the capability of high-throughput microelectronic assembly equipment (similar to 10 um). We describe the complaint interface, the assembly strategy, and the design of our re-alignment features. We demonstrate experimentally that misalignments at assembly as large as +/- 10 um are re-aligned by our self-alignment structures to +/- 1 to 2 um. Our approach enables existing microelectronics equipment to be used for single-mode optics assembly.
引用
收藏
页码:179 / 185
页数:7
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