Thermal Loading and Lifetime Estimation for Power Device Considering Mission Profiles in Wind Power Converter

被引:341
|
作者
Ma, Ke [1 ]
Liserre, Marco [1 ]
Blaabjerg, Frede [1 ]
Kerekes, Tamas [1 ]
机构
[1] Aalborg Univ, Dept Energy Technol, DK-9220 Aalborg, Denmark
关键词
IGBT; lifetime prediction; mission profiles; power semiconductor device; thermal cycling; wind power; RELIABILITY-ORIENTED DESIGN; ELECTRONICS;
D O I
10.1109/TPEL.2014.2312335
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
As a key component in the wind turbine system, the power electronic converter and its power semiconductors suffer from complicated power loadings related to environment, and are proven to have high failure rates. Therefore, correct lifetime estimation of wind power converter is crucial for the reliability improvement and also for cost reduction of wind power technology. Unfortunately, the existing lifetime estimation methods for the power electronic converter are not yet suitable in the wind power application, because the comprehensive mission profiles are not well specified and included. Consequently, a relative more advanced approach is proposed in this paper, which is based on the loading and strength analysis of devices and takes into account different time constants of the thermal behaviors in power converter. With the established methods for loading and lifetime estimation for power devices, more detailed information of the lifetime-related performance inwind power converter can be obtained. Some experimental results are also included to validate the thermal behavior of power device under different mission profiles.
引用
收藏
页码:590 / 602
页数:13
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