Design of a Unique Device for Residual Stresses Quantification by the Drilling Method Combining the PhotoStress and Digital Image Correlation

This paper presents a uniquely designed device combining the hole-drilling technique with two optical systems based on the PhotoStress and digital image correlation (DIC) method, where the digital image correlation system moves with the cutting tool. The authors aimed to verify whether the accuracy of the drilled hole according to ASTM E837-13a standard and the positioning accuracy of the device were sufficient to achieve accurate results. The experimental testing was performed on a thin specimen made from strain sensitive coating PS-1D, which allowed comparison of the results obtained by both methods. Although application of the PhotoStress method allows analysis of the strains at the edge of the cut hole, it requires a lot of experimenter's practical skills to assess the results correctly. On the other hand, the DIC method allows digital processing of the measured data. However, the problem is not only to determine the data at the edge of the hole, the results also significantly depend on the smoothing levels used. The quantitative comparison of the results obtained was performed using finite element analysis.