Layer-by-Layer Dynamic Shear Modulus in the Cross-Section of a Particle Board

The research results are aimed at the formation of ideas concerning the features of molecular motion of the components of the outer and inner layers of the particle board material in the temperature range from room temperature to 275-300 degrees C, as well as at revealing the fact of binder undercuring in the inner layers. The paper provides data on the temperature dependences of the dynamic shear modulus of the outer and inner layers of the particle board material, obtained by dynamic mechanical analysis using a torsion pendulum. We found significant differences in the nature of the dependencies for samples taken at different distances from the surface layers. The material of the outer layers is characterized by the typical pattern of a continuous irregularly consistent decrease in the dynamic shear modulus with increasing temperature, which is common to most polymeric and composite materials. A short-term intermittent increase in the dynamic shear modulus relative to neighboring areas was detected in the inner layers at 140 +/- 5 degrees C, which is not typical for materials in a stable state. There is also a tendency for the dynamic shear modulus of the particle board material to decrease at room temperature with distance from the outer layers, due to the heterogeneous fractional composition and differences in the nature of chemical cross-linking during hot pressing. It has been assumed that the detected anomalous increase in the dynamic shear modulus in the inner layers of the material at 140 +/- 5 degrees C is a symptom of the binder post-treatment process directly in conditions of its heating when measuring the dynamic shear modulus by dynamic mechanical analysis. Thus, it is concluded that the particle board sample shows maximum curing of the thermosetting binder in the layers, which are 4.5-5.0 mm distant from both surfaces. Partial undercuring of the binder occurs in the inner layers, which are more than 5.5 mm away from the surfaces. Thus, it is shown that the method of dynamic mechanical analysis can be used as a tool to control the presence in the inner layers of the particle board material of the components of thermosetting binder, undercured in the hot pressing process, which will help to obtain a material with more stable characteristics.