Trends of Power Electronic Packaging and Modeling

被引：0
|
作者：
Liu, Yong [1 ]
Irving, Scott [1 ]
Luk, Timwah [1 ]
Kinzer, Dan [1 ]
机构：
[1] Fairchild Semicond Corp, Portland, ME 04074 USA
来源：
EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3 | 2008年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A review of recent advances in power electronic packaging is presented based on the development of power device integration. The presentation will cover in more detail how advances in both semiconductor content and power advanced package design and materials have co-enabled significant advances in power device capability during recent years. Extrapolating the same trends in representative areas for the remainder of the decade serves to highlight where further improvement in materials and techniques call drive continued enhancements in usability, efficiency, reliability and overall cost of power semiconductor solutions. Along with new power packaging development, the role of modeling is key to assure successful package design. An overview of the power package modeling is presented. Challenges of power semiconductor packaging and modeling in both next generation design and assembly processes are presented and discussed.
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页码：1 / +
页数：3
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