共 50 条
- [4] Simulation of Adhesive Joint Strength in Peel Test Conditions ENGINEER OF THE XXI CENTURY, 2020, 70 : 71 - 79
- [7] On the effective constitutive properties of a thin adhesive layer loaded in peel International Journal of Fracture, 2006, 141 : 227 - 246
- [8] Modeling adhesive failure in electronic packages EPTC 2006: 8TH ELECTRONIC PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2006, : 787 - 792
- [10] Method of measuring adhesive strength of thick-film conductor by peel test Guijinshu/Precious Metals, 2000, 21 (01): : 32 - 34