Effect of Atmospheric-Pressure Plasma Treatment on the Adhesion Characteristics of Screen-Printed Ag Nanoparticles on Polyimide

被引:3
|
作者
Park, Bum-Geun [1 ]
Kim, Kwang-Seok [1 ]
Jung, Kwang-Ho [2 ]
Jung, Seung-Boo [2 ]
机构
[1] Sungkyunkwan Univ, SKKU Adv Inst Nanotechnol SAINT, Suwon 440746, South Korea
[2] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, Suwon 440746, South Korea
基金
新加坡国家研究基金会;
关键词
Atmospheric-Pressure Plasma; Adhesion Enhancement; Surface Free Energy; Flexible Electronics; Printed Electronics; SURFACE MODIFICATION; CORONA DISCHARGE; OXYGEN PLASMA; POLYETHYLENE; POLYMERS; SPECTROSCOPY; TEMPERATURE; FILMS;
D O I
10.1166/jnn.2014.10169
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
We investigated the adhesion characteristics of screen-printed silver (Ag) tracks on polyimide (PI) treated by atmospheric-pressure plasma (APP). Oxygen plasma was applied to the PI surface, and the APP-treated surface was exposed to air for various periods of time in order to evaluate the sustainability of the APP treatment. The adhesion of the Ag/PI interface was measured using a roll-type 90 peel test. The peel strength was dramatically increased by the APP treatment, but the strength decreased by around 62.7% when the APP-treated PI surface was exposed to air for 2 h. The peeled PI surface showed ductile fracture immediately after the APP treatment; however, after 2 h of exposure to air, the fracture behavior returned what was observed before the APP treatment. To analyze the deterioration of adhesion, the interface between the printed Ag track and the APP-treated PI was investigated physically and chemically. The surface morphology became rougher after the APP treatment, but the roughness slightly decreased after being exposed to air for 2 h. X-ray photoelectron spectroscopy (XPS) was used to investigate the chemical bonding of the printed Ag and the PI interface. XPS analyses show that the concentration of oxygen-containing groups decreased as the exposure time to air increased.
引用
收藏
页码:9448 / 9453
页数:6
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