共 50 条
- [1] Thermal management of advanced electronic devices by negative thermal expansion particulates Takenaka, Koshi (takenaka@nuap.nagoya-u.ac.jp), 2020, Journal of the Japan Society of Powder and Powder Metallurgy, 15 Morimoto-cho Shimogamo, Sakyo-Ku Kyoto, Japan (67): : 499 - 504
- [3] Reliability and Variability of Advanced CMOS Devices at Cryogenic Temperatures 2020 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2020,
- [4] Advanced Packaging and Thermal Management for High Power Density GaN Devices 2013 IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM (CSICS): INTEGRATED CIRCUITS IN GAAS, INP, SIGE, GAN AND OTHER COMPOUND SEMICONDUCTORS, 2013,
- [7] Simulating noise performance of advanced devices down to cryogenic temperatures UNSOLVED PROBLEMS OF NOISE AND FLUCTUATIONS, 2005, 800 : 480 - 485
- [8] Development and testing of advanced cryogenic thermal switch concepts SPACE TECHNOLOGY AND APPLICATIONS INTERNATIONAL FORUM, PTS 1 AND 2, 2000, 504 : 837 - 846
- [9] Heat switch technology for cryogenic thermal management ADVANCES IN CRYOGENIC ENGINEERING, 2017, 278