Investigating a Novel Normally-On AlGaN/GaN Capped PHEMT and the Effects of Cap Layers Thickness on its Gate Leakage Current

被引:0
|
作者
Ghafouri, Tara [1 ]
Salehi, Alireza [1 ]
Mahmoodnia, Hedie [1 ]
机构
[1] KN Toosi Univ Technol, Dept Elect Engn, Tehran 1631714191, Iran
关键词
AlGaN/GaN capped PHEMT; In0.15Ga0.85N layer; spacer layer; I-on/I-off ratio;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper the effects of cap layers thickness in the AlGaN/GaN capped pseudomorphic high electron mobility transistor (PHEMT) are investigated using Atlas/Silvaco Simulator. The proposed structure improves the prior AlGaN/GaN capped HEMT reported in the literature by insertion of an In0.15Ga0.85N layer between the AlN spacer and the GaN buffer layers and optimization of the different layers dimensions, in order to minimize gate leakage current. Simulation results demonstrate a gate leakage current of 10(-14) (A) and an I-on/I-off of higher than 11 orders of magnitude, so that it is 3 orders of magnitude higher than that of the prior non-optimal structure.
引用
收藏
页码:305 / 310
页数:6
相关论文
共 17 条
  • [1] Modeling of forward gate leakage current for normally off pGaN/AlGaN/GaN HEMTs
    Sarkar, Arghyadeep
    Haddara, Yaser M.
    SOLID-STATE ELECTRONICS, 2022, 196
  • [2] Effect of Barrier Layer Thickness on Gate Leakage Current in AlGaN/GaN HEMTs
    Turuvekere, Sreenidhi
    DasGupta, Amitava
    DasGupta, Nandita
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2015, 62 (10) : 3449 - 3452
  • [3] Simulation of Gate Leakage Current of AlGaN/GaN HEMTs: Effects of the Gate Edges and Self-Heating
    Wang, Ashu
    Zeng, Lingyan
    Wang, Wen
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2017, 6 (11) : S3025 - S3029
  • [4] DC Gate Leakage Current Model Accounting for Trapping Effects in AlGaN/GaN HEMTs
    Rodriguez, Raul
    Gonzalez, Benito
    Garcia, Javier
    Toulon, Gaetan
    Morancho, Frederic
    Nunez, Antonio
    ELECTRONICS, 2018, 7 (10)
  • [5] T-CAD simulations study on drain leakage current and its correlation with gate current for AlGaN/GaN HEMTs
    Miccoli, Cristina
    Cerantonio, Viviana
    Chini, Alessandro
    Iucolano, Ferdinando
    2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2021, : 255 - 258
  • [6] Effects of forward gate bias stressing on the leakage current of AlGaN/GaN high electron mobility transistors
    Gao, Y.
    Sasangka, W. A.
    Thompson, C. V.
    Gan, C. L.
    MICROELECTRONICS RELIABILITY, 2019, 100
  • [7] On the effects of gate-recess etching in current-collapse of different cap layers grown AlGaN/GaN high-electron-mobility transistors
    Arulkumaran, S
    Egawa, T
    Selvaraj, L
    Ishikawa, H
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2006, 45 (8-11): : L220 - L223
  • [8] On the effects of gate-recess etching in current-collapse of different cap layers grown AlGaN/GaN high-electron-mobility transistors
    Arulkumaran, Subramaniam
    Egawa, Takashi
    Selvaraj, Lawrence
    Ishikawa, Hiroyasu
    Japanese Journal of Applied Physics, Part 2: Letters, 2006, 45 (8-11):
  • [9] Normally-off AlGaN/GaN MIS-HEMT with low gate leakage current using a hydrofluoric acid pre-treatment
    Kurt, Gokhan
    Gulseren, Melisa Ekin
    Ghobadi, Turkan Gamze Ulusoy
    Ural, Sertac
    Kayal, Omer Ahmet
    Ozturk, Mustafa
    Butun, Bayram
    Kabak, Mehmet
    Ozbay, Ekmel
    SOLID-STATE ELECTRONICS, 2019, 158 : 22 - 27
  • [10] Normally-Off Metal-Insulator-Semiconductor P-GaN gated AlGaN/GaN high electron mobility transistors with low gate leakage current
    Du, Jiyao
    Pu, Taofei
    Li, Xiaobo
    Li, Liuan
    Ao, Jin-Ping
    Gao, Hongwei
    JOURNAL OF CRYSTAL GROWTH, 2023, 611