Ni-P-SiC composite produced by pulse and direct current plating

被引：45
|
作者：
Hou, Kung-Hsu
Hwu, Wen-Hwa
Ke, Shih-Tsung
Ger, Ming-Der
机构：
[1] Natl Def Univ, Chung Cheng Inst Technol, Dept Appl Chem, Tao Yuan 335, Taiwan
[2] Natl Def Univ, Chung Cheng Inst Technol, Dept Vehicle Engn, Tao Yuan 335, Taiwan
来源：
MATERIALS CHEMISTRY AND PHYSICS | 2006年 / 100卷 / 01期
关键词：
Ni-P alloy; composite electroplating; pulse plating; direct plating;
D O I：
10.1016/j.matchemphys.2005.12.016
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This study attempted to incorporate 300 nm SiC particles into a Ni-P alloy matrix by pulse current (PC) and direct current (dc) plating. The effects of bath composition and operating conditions of electrodeposited Ni-P-SiC composite coatings were studied, and the micro-hardness of the deposits was determined. Both plating methods showed that the phosphorus content in the deposit falls with increasing SiC content in the bath, and that the SiC content in the composite coating rises with rising SiC content in the bath. The pulse plating deposit with SiC particles 0.2-1.5 wt.% was higher than direct current plating with SiC particles 0.2-0.5 wt.% in deposits. The wear-proof shows that the tribological behavior of Ni-P-SiC of the PC plating is better than that of the dc plating deposit, due to the higher ultra-fine SiC particles. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码：54 / 59
页数：6
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