Microhole drilling through electrochemical processes: A review

被引:44
|
作者
Rahman, Zishanur [1 ]
Das, Alok Kumar [1 ]
Chattopadhyaya, Somnath [1 ]
机构
[1] Indian Inst Technol ISM, Dept Mech Engn, Dhanbad, Bihar, India
关键词
mu ECM; electrolyte; inter-electrode gap; microdrilling; microhole; microtool; DISCHARGE MACHINING ECDM; GREY RELATIONAL ANALYSIS; ULTRA-SHORT PULSES; STAINLESS-STEEL; BIOMEDICAL APPLICATIONS; MICROMACHINING PROCESS; HOLE CHARACTERISTICS; PROCESS PARAMETERS; EMM PROCESS; TOOL;
D O I
10.1080/10426914.2017.1401721
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Day-to-day interest is growing in the drilling of high aspect-ratio deep microholes in various hard-to-machine and newer materials. Besides cost-effectiveness in the manufacturing process, an accurate dimension with the good surface finish is essential for microhole drilling. The conventional methods encounter various problems such as residue stresses, heat generation near cutting zone, high tool-wear, etc. Electrochemical microdrilling (ECMD) is one of the cost-effective techniques, provide a better alternative in drilling microholes with reasonably accurate dimensions and good surface finish in various industrial applications especially in computer, electronic, and aerospace industries. This article reviews current researches and developments of electrochemical processes for circular microholes drilling. It highlights the effects of various key factors (such as the development of microtools, electrolyte, inter-electrode-gap monitoring and control, etc.) on the aspect-ratio and accuracy of circular microholes, produced by ECMD. For further research, it will open up various challenging opportunities, especially in the field of (i) development and handling of microtool electrodes, (ii) development and handling of electrolytes medium, (iii) development in monitoring and controlling techniques of inter-electrode-gap, and (iv) development in strategies for process control for drilling high quality, deep and high aspect-ratio circular microholes into hard-to-machine materials using ECMD.
引用
收藏
页码:1379 / 1405
页数:27
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