Investigation of Lanthanum Silicate Conditions on 4H-SiC MOSFET Characteristics

被引:11
|
作者
Yang, Xiangyu [1 ]
Lee, Bongmook [1 ]
Misra, Veena [1 ]
机构
[1] N Carolina State Univ, Dept Elect & Comp Engn, Raleigh, NC 27606 USA
关键词
Atomic layer deposition (ALD); ALD SiO2; lanthanum silicate (LaSiOx); mobility; silicon carbide (SiC); MOBILITY;
D O I
10.1109/TED.2015.2480047
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The lanthanum silicate interface engineering has been shown to dramatically improve the mobility of 4H-silicon carbide (SiC) MOSFETs. We studied the impact of post deposition annealing (PDA) conditions and the initial lanthanum oxide (La2O3) thickness on the MOSFET performance. The combination of 900 degrees C PDA and 1 nm La2O3 leads to highest field-effect mobility. Higher PDA temperature leads to mobility reduction due to lower lanthanum concentration at the SiC/dielectric interface. The peak mobility and threshold voltage show strong dependence on the initial La2O3 thickness.
引用
收藏
页码:3781 / 3785
页数:5
相关论文
共 50 条
  • [1] Enhanced interfacial and electrical characteristics of 4H-SiC MOS capacitor with lanthanum silicate passivation interlayer
    Wang, Qian
    Cheng, Xinhong
    Zheng, Li
    Ye, Peiyi
    Li, Menglu
    Shen, Lingyan
    Li, Jingjie
    Zhang, Dongliang
    Gu, Ziyue
    Yu, Yuehui
    APPLIED SURFACE SCIENCE, 2017, 410 : 326 - 331
  • [2] Reliability Investigation of 4H-SiC MOSFET Based on TCAD Simulation
    Luo, Houcai
    Huang, Yiping
    Zheng, Kai
    Tan, Chunjian
    Wang, Liming
    Wang, Shaogang
    Ye, Huaiyu
    Chen, Xianping
    2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, : 956 - 960
  • [3] High Mobility 4H-SiC MOSFET
    O'Neill, A.
    Arith, F.
    Urresti, J.
    Vasilevskiy, K.
    Wright, N.
    Olsen, S.
    2018 14TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT), 2018, : 523 - 526
  • [4] Effect of lanthanum silicate interface layer on the electrical characteristics of 4H-SiC metal-oxide-semiconductor capacitors
    Lei, Y. M.
    Wakabayashi, H.
    Tsutsui, K.
    Iwai, H.
    Furuhashi, M.
    Tomohisa, S.
    Yamakawa, S.
    Kakushima, K.
    MICROELECTRONICS RELIABILITY, 2018, 84 : 248 - 252
  • [5] Investigation on 4H-SiC MOSFET with three-section edge termination
    Zhou, Xin
    Yuan, ZhangYi'an
    Deng, Xiaochuan
    Li, Xuan
    Qiao, Ming
    Li, Zhaoji
    Zhang, Bo
    SUPERLATTICES AND MICROSTRUCTURES, 2018, 124 : 139 - 144
  • [6] A 4H-SiC Trench MOSFET with Thick Bottom Oxide for Improving Characteristics
    Takaya, Hidefumi
    Morimoto, Jun
    Hamada, Kimimori
    Yamamoto, Toshimasa
    Sakakibara, Jun
    Watanabe, Yukihiko
    Soejima, Narumasa
    2013 25TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2013, : 43 - 46
  • [7] Thin PSG Process for 4H-SiC MOSFET
    Sharma, Y. K.
    Ahyi, A. C.
    Issacs-Smith, T.
    Modic, A.
    Xu, Y.
    Garfunkel, E.
    Jennings, M. R.
    Fisher, C.
    Thomas, S. M.
    Mawby, P.
    Dhar, S.
    Feldman, L. C.
    Williams, J. R.
    SILICON CARBIDE AND RELATED MATERIALS 2013, PTS 1 AND 2, 2014, 778-780 : 513 - +
  • [8] Investigation of On and Off State Characteristics of 4H-SiC DMOSFETs
    Potbhare, Siddharth
    Goldsman, Neil
    Akturk, Akin
    Lelis, Aivars
    Green, Ronald
    SILICON CARBIDE AND RELATED MATERIALS 2008, 2009, 615-617 : 805 - 808
  • [9] Study on the temperature properties of 4H-SiC MOSFET
    Xu, CF
    Yang, YT
    Liu, L
    ACTA PHYSICA SINICA, 2002, 51 (05) : 1113 - 1117
  • [10] Study of 4H-SiC trench MOSFET structures
    Chen, L
    Guy, OJ
    Jennings, MR
    Igic, P
    Wilks, SP
    Mawby, PA
    SOLID-STATE ELECTRONICS, 2005, 49 (07) : 1081 - 1085