Charge Trap Transistor (CTT): An Embedded Fully Logic-Compatible Multiple-Time Programmable Non-Volatile Memory Element for High-k-Metal-Gate CMOS Technologies
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作者:
Khan, Faraz
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Univ Calif Los Angeles, Dept Elect Engn, CHIPS, Los Angeles, CA 90095 USA
Global Foundries, Adv Technol Dev, Malta, NY 12020 USAUniv Calif Los Angeles, Dept Elect Engn, CHIPS, Los Angeles, CA 90095 USA
Khan, Faraz
[1
,2
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Cartier, Eduard
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IBM Res, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USAUniv Calif Los Angeles, Dept Elect Engn, CHIPS, Los Angeles, CA 90095 USA
Cartier, Eduard
[3
]
Woo, Jason C. S.
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Univ Calif Los Angeles, Dept Elect Engn, CHIPS, Los Angeles, CA 90095 USAUniv Calif Los Angeles, Dept Elect Engn, CHIPS, Los Angeles, CA 90095 USA
Woo, Jason C. S.
[1
]
Iyer, Subramanian S.
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Univ Calif Los Angeles, Dept Elect Engn, CHIPS, Los Angeles, CA 90095 USAUniv Calif Los Angeles, Dept Elect Engn, CHIPS, Los Angeles, CA 90095 USA
Iyer, Subramanian S.
[1
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机构:
[1] Univ Calif Los Angeles, Dept Elect Engn, CHIPS, Los Angeles, CA 90095 USA
[2] Global Foundries, Adv Technol Dev, Malta, NY 12020 USA
[3] IBM Res, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA
The availability of on-chip non-volatile memory for advanced high-k-metal-gate CMOS technology nodes has been limited due to integration and scaling challenges as well as operational voltage incompatibilities, while its need continues to grow rapidly in modern high-performance systems. By exploiting intrinsic device self-heatingenhancedcharge trapping in as fabricated highk- metal-gate logic devices, we introduce a unique multipletime programmable embedded non-volatile memory element, called the 'charge trap transistor' (CTT), for high-k-metal-gateCMOS technologies. Functionality and feasibility of using CTT memory devices have been demonstrated on 22 nm planar and 14 nm FinFET technology platforms, including fully functional product prototype memory arrays. These transistor memory devices offer high density (similar to 0.144 mu m(2)/bit for 22 nm and similar to 0.082 mu m(2)/bit for 14 nm technology), logic voltage compatible and low peak power operation (similar to 4mW), and excellent retention for a fully integrated and scalable embedded non-volatile memory without added process complexity or masks.
机构:
GLOBALFOUNDRIES Inc, East Fishkill, NY 12533 USA
Univ Calif Los Angeles, Dept Elect Engn, Los Angeles, CA 90095 USAGLOBALFOUNDRIES Engn Pvt Ltd, Bangalore 560045, Karnataka, India
Khan, Faraz
Kirihata, Toshiaki
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机构:
GLOBALFOUNDRIES Inc, East Fishkill, NY 12533 USAGLOBALFOUNDRIES Engn Pvt Ltd, Bangalore 560045, Karnataka, India
Kirihata, Toshiaki
Iyer, Subramanian S.
论文数: 0引用数: 0
h-index: 0
机构:
GLOBALFOUNDRIES Inc, East Fishkill, NY 12533 USA
Univ Calif Los Angeles, Dept Elect Engn, Los Angeles, CA 90095 USAGLOBALFOUNDRIES Engn Pvt Ltd, Bangalore 560045, Karnataka, India