A unique package design for digital micromirror devices(TM)

A gasket sealed package for a Digital Light Processing(TM) (DLP(TM)) device is described. The DLP device is a light switch that is ideally suited for use in high resolution displays as well as other applications. The gasket sealed package is created by using two metal clamps to compress an elastomer ring between the device and an optical window. The DLP array requires a new approach to packaging because of the large size of the die. The package design was refined as requirements changed and new information about performance of the package was generated. Moisture permeability into the cavity was measured directly using micro moisture sensors. Permeability rates were estimated to be 2 x 10(-13) grams/sec-cm-torr at room temperature. Temperature effects on moisture permeability were estimated using a permeation cup procedure.