Value chain for photonic ASICs prototyping JePPIX technology platforms for InP and TriPleX photonic ASICs

被引：0
|
作者：
Lawniczuk, Katarzyna [1 ]
机构：
[1] Eindhoven Univ Technol, JePPIX, POB 513, NL-5600 MB Eindhoven, Netherlands
来源：
2015 PHOTONICS CONFERENCE (IPC) | 2015年
关键词：
generic integration; application specific photonic integrated circuit; multi-project wafer run; InP; TriPleX; technology platforms; LASER;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Prototyping of photonic ASICs is easier than ever before. The value chain for development of photonic chips from application idea through simulation, design using advanced PDK tools, till fabrication and packaging is entirely enabled.
引用
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页数：2
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