3D Test

被引：0

作者：

Henkel, Joerg

机构：

[1] Henkel, Jörg

来源：

关键词：

D O I：

10.1109/MDAT.2016.2642161

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

引用

页码：4 / 5

页数：2

共 50 条

[1] 3D's test flight
Koenig, Bill
Manufacturing Engineering, 2015, 154 (09): : 77 - 81
[2] 3D Test: A New Paradigm in Semiconductor Test
Kusko, Mary
Nigh, Phil
IEEE DESIGN & TEST OF COMPUTERS, 2011, 28 (04): : 102 - 103
[3] An algorithm for a 3D simplicity test
Latecki, L
Ma, CM
COMPUTER VISION AND IMAGE UNDERSTANDING, 1996, 63 (02) : 388 - 393
[4] 3D's TEST FLIGHT
Koenig, Bill
MANUFACTURING ENGINEERING, 2015, : 77 - 81
[5] 3D integration: not a windfall for test
Slessor, Mike
SOLID STATE TECHNOLOGY, 2012, 55 (01) : 24 - 24
[6] Test drive composites in 3D
British Dental Journal, 2010, 209 (11) : 582 - 582
[7] Putting 3D printing to the test
Kunststoffe International, 2019, 109 (04): : 8 - 10
[8] Screen test for 3D design
Avram, P
PROFESSIONAL ENGINEERING, 1998, 11 (03) : 32 - 33
[9] Test Challenges for 3D Integration
Bottoms, W. R.
2011 IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE (CICC), 2011,
[10] 3D'S test flight: 3D printing begins to soar in aerospace
Koenig, Bill
Manufacturing Engineering, 2015, 154 (05):