Impact of Surface Recombination on Single-Event Charge Collection in an SOI Technology

被引:8
|
作者
Tonigan, Andrew M. [1 ,2 ]
Ball, Dennis, Jr. [2 ]
Vizkelethy, Gyorgy [1 ]
Black, Jeffrey [1 ]
Black, Dolores [1 ]
Trippe, James [1 ]
Bielejec, Edward [1 ]
Alles, Michael L. [2 ]
Reed, Robert [2 ]
Schrimpf, Ronald D. [2 ]
机构
[1] Sandia Natl Labs, Albuquerque, NM 87123 USA
[2] Vanderbilt Univ, Dept Elect Engn & Comp Sci, Nashville, TN 37212 USA
关键词
Interface quality; microbeam; silicon-on-insulator (SOI); single-event effects; surface recombination; CARRIER RECOMBINATION; RADIATION; NM; SENSITIVITY; DEPENDENCE; LIFETIME; DEVICES;
D O I
10.1109/TNS.2021.3056898
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Semiconductor-insulator interfaces play an important role in the reliability of integrated devices; however, the impact of these interfaces on the physical mechanisms related to single-event effects has not been previously reported. We present experimental data that demonstrate that single-event charge collection can be impacted by changes in interface quality. The experimental data, combined with simulations, show that single-event response may depend on surface recombination at interface defects. The effect depends on strike location and increases with increasing linear energy transfer (LET). Surface recombination can affect single-event charge collection for interfaces with a surface recombination velocity (SRV) of 1000 cm/s and is a dominant charge collection mechanism with SRV > 10(5) cm/s.
引用
收藏
页码:305 / 311
页数:7
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