Preparation of cyanide-free gold-tin alloys by ultrasonic-assisted pulse electrodeposition

被引：5

作者：

Gong, Le ^{[1
]}

Zhao, Fengjun ^{[1
]}

Wang, Zhen ^{[1
]}

Sui, Qingxuan ^{[1
]}

Xu, Shurong ^{[1
]}

Liu, Bo ^{[1
]}

Yuan, Quan ^{[1
]}

Wen, Hao ^{[1
]}

Xiao, Tianyi ^{[1
]}

Liu, Gang ^{[2
,3
]}

Liu, Jun ^{[1
]}

Chen, Zihua ^{[2
,3
]}

机构：

[1] Cent South Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China

[2] Cent South Univ, Xiangya Hosp, Dept Gen Surg, Changsha 410008, Peoples R China

[3] Cent South Univ, Xiangya Hosp, Dept Int Joint Res Ctr Minimally Invas Endoscop Te, Changsha 410008, Peoples R China

来源：

MATERIALS LETTERS | 2022年 / 317卷

关键词：

Ultrasonic; Electrodeposition; Gold-tin alloys; Diffusion;

D O I：

10.1016/j.matlet.2022.132029

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This work adopted a novel method to prepare cyanide-free gold-tin alloys thin-film via using ultrasonic-assisted pulse electrodeposition. The effects of ultrasonic were studied and the optimal ultrasonic time was determined. It was demonstrated that ultrasonic wave can enhance the ion diffusion ability of the cyanide-free Au-Sn alloys electroplating solution and hinder the generation of bubbles on the surface of the cathode. As a result, a uniform and dense gold-tin alloys coating was obtained. Moreover, the ultrasonic facilitated the increase of deposition rate and the reduction of the content of Sn with the range of 30-60 at.% compared with stirring-pulse electrodeposition. The gold-tin alloys thin-film can be used in electronic packaging.

引用

页数：5

共 32 条

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