Integrated Module Structure of Fan-out Wafer Level Package for Terahertz Antenna

We propose a novel integrated antenna module based on fan-out wafer level package (FO-WLP) for terahertz applications. A patch structure is employed for an antenna since it is suited for low height module. Both an insulator made of polyphenylene ether (PPE) and a reflector made of copper block, together with a chip for high frequency operation, were embedded into a mold used for FO-WLP. A driven element of the antenna and an interconnection between the antenna and the chip were formed by redistribution layer (RDL) technology. The height of the insulator was set to 40 um in order to maximize the radiation efficiency of 300-GHz radio wave. We developed the module and evaluated the performances. Measured frequency characteristics were well matched to analytical result. The measured loss of reflection characteristics of developed module was 3 dB. Therefore, the module achieved 1.5-dB insertion loss even at terahertz frequency. These results exhibit proposing structure is effective as a terahertz module.