Wafer scale patterning by soft UV-nanoimprint lithography

We present first results on wafer scale patterning within one imprint step only, using Soft UV-Nanoimprint Lithography (LTV-NIL). In this process, flexible transparent stamps, fabricated by cast moulding ensure a conformal contact, whereas the usage of low viscosity U-V-curable resists allows three-dimensional pattern generation at low pressure (<1 bar) and room temperature. Technical aspects that will be covered in this paper include the master and stamp fabrication and a new imprint tools developed by EV Group, Austria. To demonstrate the applicability of this technique, imprints on 100 nun silicon wafers have been analysed with special emphasis to the residual resist thickness h,. In addition, data on the dimensional stability of the imprint process are presented. (C) 2004 Elsevier B.V. All rights reserved.