A manufacturing perspective of physical design characterization

As semiconductor manufacturers continue to aggressively push technology and lithography, the traditional model of well-defined boundaries between development and manufacturing activities has blurred. Historically, physical design characterization (PDC) has been the focus of product or design engineers. Most manufacturers focus their resources and expertise upon process control and modification to achieve the anticipated or desired productivities, while the majority of the design and product engineers' responsibilities precede the qualification. This paper will introduce PDC from a manufacturing perspective and the value of design-specific information for successful process control. Several PDC tools will be described in terms of this integrated approach and the current embodiment at the IBM Microelectronics Vermont facility. Specifically, these tools include pattern density calculations, critical area extractions, and "swampfinding", a method for locating specific design-process sensitivities. This paper will then develop both the technical and business strategies that leverage this information into the manufacturing processes. To clearly illustrate the concepts introduced, several examples of PDC results augmented with traditional characterization information, along with the ensuing manufacturing actions will be reviewed. Finally, the larger picture of physical design characterization in manufacturing, and the impact upon development, will be further developed.