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- [8] Reduction of Cu-Ni-Pd Pad Discoloration Caused by Cu Re-deposition PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 286 - 288
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- [10] Cu Wire Bonding on Cu-Ni-Pd bond pad and leads: From Development to Robust Production PROCEEDINGS OF THE 2010 34TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY CONFERENCE (IEMT 2010), 2011,