Analysis of EBG structures using SPICE models of multiple planes

被引：0
|
作者：
Kobayashi, Naoki [1 ]
Morishita, Ken [1 ]
Harada, Takashi [1 ]
机构：
[1] NEC Syst Jisso Res Labs, Kanagawa 2291198, Japan
来源：
2008 IEEE-EPEP ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 2008年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Compared to measurements, SPICE models of multiple planes are demonstrated to be effective for analyzing electromagnetic band gap (EBG) structures where unit cells are parallel waveguides coupled to stacked cavities through via posts.
引用
收藏
页码：101 / 104
页数：4
相关论文
共 50 条
  • [1] Effects of Discrete Bypass Capacitors in Power/Ground Planes with EBG Structures
    Farzan, S. Mohamad Dawood
    Ramahi, Omar M.
    2008 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3, 2008, : 668 - +
  • [2] ANALOG SPICE SIMULATION-MODELS - SPICE MODELS ENJOY MULTIPLE SOURCES
    KERRIDGE, B
    EDN, 1990, 35 (18) : 79 - 84
  • [3] Analysis of a PCB-Chassis System Including Different Sizes of Multiple Planes Based on SPICE
    Kobayashi, Naoki
    Hubing, Todd
    Harada, Takashi
    2008 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC EUROPE), 2008, : 254 - +
  • [4] Miniaturization of Planar EBG Structure using Dual Power Planes
    Lin, Xingxiaoyu
    Toyota, Yoshitaka
    Iokibe, Kengo
    Kaneko, Toshiyuki
    2017 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2017, : 241 - 243
  • [5] Absorbing Surfaces Using EBG Structures
    Assimonis, Stylianos D.
    Kollatou, Theofano M.
    Yioultsis, Traianos V.
    Antonopoulos, Christos S.
    IEEE TRANSACTIONS ON MAGNETICS, 2014, 50 (02) : 197 - 200
  • [6] Study on Triangular EBG Unit Cell Structures for Suppression of SSN in Power/Ground Planes
    Kwon, Jong Hwa
    Sim, Dong Uk
    Kwak, Sang Il
    2015 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2015, : 1290 - 1293
  • [7] Pattern Reconfigurable Antenna using EBG Structures
    Ismail, M. F.
    Majid, H. A.
    Rahim, M. K. A.
    Hamid, M. R.
    Yusof, M. F. M.
    PROCEEDINGS OF THE 2018 IEEE 7TH ASIA-PACIFIC CONFERENCE ON ANTENNAS AND PROPAGATION (APCAP), 2018, : 236 - 237
  • [8] FDTD analysis of EBG structures with macromodel cloning
    Podwalski, Jakub
    Sypek, Piotr
    Kulas, Lukasz
    Mrozowski, Michal
    2006 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-5, 2006, : 296 - +
  • [9] Analysis of 3-D interconnect structures with PEEC using SPICE
    Wollenberg, G
    Görisch, A
    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 1999, 41 (04) : 412 - 417
  • [10] Skin effects models for transmission line structures using generic SPICE circuit simulators
    Sen, BK
    Wheeler, RL
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 1998, : 128 - 131
12345