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- [2] Thermal cycling aging effects on the tensile property of lead-free solder Sn-3Ag-0.5Cu 2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 708 - 711
- [3] Mechanical Test after Temperature Cycling on Lead-free Sn-3Ag-0.5Cu Solder Joint 2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 927 - 930
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- [6] Microstructure and properties of Sn1.0Ag0.5Cu and Sn3.0Ag0.5Cu lead-free solder Xiyou Jinshu, 7 (589-593):
- [10] The Microstructure and Fracture Behavior of Sn-3Ag-0.5Cu Solder Joints 2008 EMAP CONFERENCE PROCEEDINGS, 2008, : 293 - +