Torsional fatigue with axial constant stress for Sn-3Ag-0.5Cu lead-free solder

被引:11
|
作者
Liang, Ting [1 ]
Liang, Yongfeng [1 ]
Fang, Jiaye [1 ]
Chen, Gang [1 ]
Chen, Xu [1 ]
机构
[1] Tianjin Univ, Sch Chem Engn & Technol, Tianjin 300072, Peoples R China
基金
中国国家自然科学基金;
关键词
Multiaxial; Ratcheting-fatigue; Constitutive model; Fatigue life prediction; Sn-3Ag-0.5Cu; KINEMATIC HARDENING RULES; CONSTITUTIVE MODEL; RATCHETING DEFORMATION; DYNAMIC RECOVERY; STAINLESS-STEEL; CRITICAL STATE; BEHAVIOR; ALLOY; JOINTS; LIFE;
D O I
10.1016/j.ijfatigue.2014.02.008
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
A series of multiaxial ratcheting-fatigue interaction tests have been carried out on Sn-3Ag-0.5Cu lead-free solder specimens. All tests were conducted under cyclic shear strain with the constant axial stress at the room temperature with the shear strain rate of 5 x 10(-3) s(-1). It was found that the ratcheting strain increased with increasing axial stress and shear strain amplitude while the fatigue life decreased at the same time. The ratcheting strain rate was linear with axial stress in double logarithmic coordinate. The Ohno-Wang II constitutive model was employed to simulate the stress-strain responses. Several fatigue life prediction models were applied to predict the multiaxial ratcheting-fatigue life of the Sn-3Ag-0.5Cu lead-free solder. The Gao-Chen model which adopted the maximum shear strain and the ratcheting strain rate as the damage parameter predicted the multiaxial ratcheting fatigue life well. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:203 / 211
页数:9
相关论文
共 50 条
  • [1] Effect of Fe particles on microstructures and properties of Sn-3Ag-0.5Cu lead-free solder
    Liu, Xiao-Ying
    Ma, Hai-Tao
    Luo, Zhong-Bing
    Zhao, Yan-Hui
    Huang, Ming-Liang
    Wang, Lai
    Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2012, 22 (04): : 1169 - 1176
  • [2] Thermal cycling aging effects on the tensile property of lead-free solder Sn-3Ag-0.5Cu
    Chen, Bingjie
    Wang, Kaimin
    Yao, Yao
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 708 - 711
  • [3] Mechanical Test after Temperature Cycling on Lead-free Sn-3Ag-0.5Cu Solder Joint
    Peng, Chung-Nan
    Duh, Jenq-Gong
    2008 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING, VOLS 1 AND 2, 2008, : 927 - 930
  • [4] Comparison of Impact Properties of Sn-9Zn and Sn-3Ag-0.5Cu Lead-free Solder Ball Joints
    Shohji, Ikuo
    Shimoyama, Satoshi
    Ishikawa, Hisao
    Kojima, Masao
    ADVANCES IN FRACTURE AND DAMAGE MECHANICS VII, 2008, 385-387 : 429 - +
  • [5] Effect of crystallographic anisotropy of β-tin grains on thermal fatigue properties of Sn-1Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solder interconnects
    Terashima, S.
    Kobayashi, T.
    Tanaka, M.
    SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, 2008, 13 (08) : 732 - 738
  • [6] Microstructure and properties of Sn1.0Ag0.5Cu and Sn3.0Ag0.5Cu lead-free solder
    School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou
    221116, China
    不详
    450001, China
    Xiyou Jinshu, 7 (589-593):
  • [7] Effect of axial ratcheting deformation on torsional low cycle fatigue life of lead-free solder Sn-3.5Ag
    Gao, Hong
    Chen, Xu
    INTERNATIONAL JOURNAL OF FATIGUE, 2009, 31 (02) : 276 - 283
  • [8] The Role of Lengthscale in the Creep of Sn-3Ag-0.5Cu Solder Microstructures
    Gu, Tianhong
    Gourlay, Christopher M.
    Britton, T. Ben
    JOURNAL OF ELECTRONIC MATERIALS, 2021, 50 (03) : 926 - 938
  • [9] In-situ study of creep in Sn-3Ag-0.5Cu solder
    Gu, Tianhong
    Tong, Vivian S.
    Gourlay, Christopher M.
    Ben Britton, T.
    ACTA MATERIALIA, 2020, 196 (196) : 31 - 43
  • [10] The Microstructure and Fracture Behavior of Sn-3Ag-0.5Cu Solder Joints
    Wang, T. S.
    Liu, S. C.
    Huang, Y. L.
    Lin, K. L.
    Lai, Y. S.
    2008 EMAP CONFERENCE PROCEEDINGS, 2008, : 293 - +