共 50 条
- [1] A Low-Cost Dielectrophoretic Chip with 3D Overlapping Electrodes for Cell Trapping Applications 2018 IEEE 8TH ANNUAL INTERNATIONAL CONFERENCE ON CYBER TECHNOLOGY IN AUTOMATION, CONTROL, AND INTELLIGENT SYSTEMS (IEEE-CYBER), 2018, : 1600 - 1604
- [2] Low-Cost 3D Chip Stacking with ThruChip Wireless Connections 2014 IEEE HOT CHIPS 26 SYMPOSIUM (HCS), 2014,
- [3] Development of Chip-on-Chip with Face to Face Technology as a Low Cost Alternative for 3D Packaging 2013 IEEE 63RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2013, : 955 - 965
- [5] Yield and cost modeling for 3D chip stack technologies PROCEEDINGS OF THE IEEE 2006 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2006, : 357 - 360
- [7] A Low cost, Efficient Method for Chip Fabrication in Cell Analysis 2016 23RD IRANIAN CONFERENCE ON BIOMEDICAL ENGINEERING AND 2016 1ST INTERNATIONAL IRANIAN CONFERENCE ON BIOMEDICAL ENGINEERING (ICBME), 2016, : 88 - 91
- [8] Cost-Aware Lifetime Yield Analysis of Heterogeneous 3D On-Chip Cache 2009 IEEE INTERNATIONAL WORKSHOP ON MEMORY TECHNOLOGY, DESIGN, AND TESTING, PROCEEDINGS, 2009, : 65 - +
- [9] Analysis of Uncertainty and Repeatability of a Low-Cost 3D Laser Scanner SENSORS, 2012, 12 (07): : 9046 - 9054
- [10] Characterization of a low-cost markerless system for 3D gait analysis 2020 IEEE INTERNATIONAL SYMPOSIUM ON MEDICAL MEASUREMENTS AND APPLICATIONS (MEMEA), 2020,