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- [1] Study of 3D SiP (System-in-Package) Module for Package-on-Package Application Using Multi-layer PCB Manufacturing Process 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 109 - 112
- [2] RF-microwave multi-layer integrated passives using fully organic System on Package(SOP) technology 2001 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2001, : 1731 - 1734
- [3] Design of a dual frequency oscillator for simultaneous multi-band radio communication on a multi-layer liquid crystalline polymer substrate 2006 IEEE RADIO AND WIRELESS SYMPOSIUM, PROCEEDINGS, 2006, : 431 - 434
- [5] Low Phase Noise Integrated Mechanically Tunable Oscillator Based on Multi-layer SIW Bandpass Filter 2018 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS (APMC), 2018, : 1127 - 1129
- [6] 3D integration and characterization of high Q passives on multilayer liquid crystalline polymer (M-LCP) based substrate 2005 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS, VOLS 1-5, 2005, : 327 - 330
- [8] Design of 2D Rotman-lens Multi-beam Antenna using Multi-layer Substrate Integrated Waveguide 2018 IEEE MTT-S INTERNATIONAL CONFERENCE ON MICROWAVES FOR INTELLIGENT MOBILITY (ICMIM), 2018, : 82 - 85