Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

被引:10
|
作者
Jeong, Gyuwon [1 ,2 ]
Yu, Dong-Yurl [1 ,3 ]
Baek, Seongju [1 ,4 ]
Bang, Junghwan [1 ]
Lee, Tae-Ik [1 ]
Jung, Seung-Boo [2 ]
Kim, JungSoo [1 ]
Ko, Yong-Ho [1 ,5 ]
机构
[1] Inst Ind Technol KITECH, Adv Funct Technol R&D Dept, 156 Gaetbeol Ro, Incheon 21999, South Korea
[2] Sungkyunkwan Univ, Sch Adv Mat Sci & Engn, 2066 Seobu Ro, Suwon 16419, Gyeonggo Do, South Korea
[3] Korea Univ, Dept Mat Sci & Engn, 145 Anam Ro, Seoul 02841, South Korea
[4] Incheon Natl Univ, Dept Mat Sci & Engn, 119 Acad Ro, Incheon 22012, South Korea
[5] Univ Sci & Technol, Dept Ind Technol, 217 Gajeong Ro, Daejeon 34113, South Korea
关键词
low-temperature bonding; laser process; Ag nanoparticle (Ag NP); interfacial reaction; intermetallic compounds (IMCs); mechanical property; INTERMETALLIC COMPOUND; EUTECTIC SOLDER; CU SOLDER; SN; GROWTH; INTERCONNECTS; RELIABILITY;
D O I
10.3390/ma14020335
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn-58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn-58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu-Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn-58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.
引用
收藏
页码:1 / 16
页数:16
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