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Introduction to the Special Issue on the 2020 IEEE International Solid-State Circuits Conference (ISSCC)
被引:0
|作者:
Mohseni, Pedram
[1
]
Charbon, Edoardo
[2
]
机构:
[1] Case Western Reserve Univ, Dept Elect Comp & Syst Engn, Cleveland, OH 44106 USA
[2] Swiss Fed Inst Technol Lausanne EPFL, CH-1015 Lausanne, Switzerland
关键词:
D O I:
10.1109/JSSC.2020.3024381
中图分类号:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号:
0808 ;
0809 ;
摘要:
It is an annual tradition ever from the start of the IEEE Journal of Solid-State Circuits (JSSC) in 1966 to publish extended manuscripts of a selected set of papers presented at the annual International Solid-State Circuits Conference (ISSCC). In this November issue, you will find selected papers from the Imagers, Medical, MEMS, and Displays (IMMD) and the Technology Directions (TD) sessions. Most of the bio-related papers are covered in these topics. Next month, the sessions of Analog, Power Management, Data Converters, RF, and Wireless will be covered, and in January, you will find the selected papers from the Wireline, Digital Circuits, Digital Architectures and Systems, Memory, and Machine Learning subcommittees.
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页码:2847 / 2848
页数:2
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