Assembly processes comparison for a miniaturized laser used for the Exomars European Space Agency mission

被引：11

作者：

Ribes-Pleguezuelo, Pol ^{[1
,2
]}

Moral Inza, Andoni ^{[3
]}

Gilaberte Basset, Marta ^{[4
]}

Rodriguez, Pablo ^{[3
]}

Rodriguez, Gemma ^{[5
]}

Laudisio, Marco ^{[5
]}

Galan, Miguel ^{[4
]}

Hornaff, Marcel ^{[1
]}

Beckert, Erik ^{[1
]}

Eberhardt, Ramona ^{[1
]}

Tuennermann, Andreas ^{[1
,2
]}

机构：

[1] Fraunhofer Inst Appl Opt & Precis Engn IOF, Albert Einstein Str 7, D-07745 Jena, Germany

[2] Friedrich Schiller Univ Jena, Inst Appl Phys, Abbe Ctr Photon, Max Wien Pl 1, D-07743 Jena, Germany

[3] INTA, Ctra Ajalvir Km4, Torrejon De Ardoz 28850, Spain

[4] Monocrom SL, Dept R&D, C Vilanoveta 6, Vilanova I La Geltru 08800, Spain

[5] LIDAX Ingn, Antonio Alonso Martin 1, Paracuellos De Jarama 28860, Spain

来源：

OPTICAL ENGINEERING | 2016年 / 55卷 / 11期

关键词：

diode-pumped solid-state laser; Raman spectroscopy; ESA Exomars mission; solderjet technology;

D O I：

10.1117/1.OE.55.11.116107

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

A miniaturized diode-pumped solid-state laser (DPSSL) designed as part of the Raman laser spectrometer (RLS) instrument for the European Space Agency (ESA) Exomars mission 2020 is assembled and tested for the mission purpose and requirements. Two different processes were tried for the laser assembling: one based on adhesives, following traditional laser manufacturing processes; another based on a low-stress and organic-free soldering technique called solderjet bumping technology. The manufactured devices were tested for the processes validation by passing mechanical, thermal cycles, radiation, and optical functional tests. The comparison analysis showed a device improvement in terms of reliability of the optical performances from the soldered to the assembled by adhesive-based means. (C) 2016 Society of Photo-Optical Instrumentation Engineers (SPIE)

引用

页数：8

共 32 条

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