Ultra-Compact Wideband Ka-Band CMOS Hybrid Ring

被引：0

作者：

Chirala, M. ^{[1
]}

Nguyen, C. ^{[1
]}

机构：

[1] Texas A&M Univ, Dept Elect & Comp Engn, College Stn, TX 77843 USA

来源：

ECTI-CON: 2009 6TH INTERNATIONAL CONFERENCE ON ELECTRICAL ENGINEERING/ELECTRONICS, COMPUTER, TELECOMMUNICATIONS AND INFORMATION TECHNOLOGY, VOLS 1 AND 2 | 2009年

关键词：

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

A new microstrip ring hybrid has been developed in Ka-band (26.5-40 GHz) using multiple metal layers in a standard 0.25-mu m RF/mixed signal CMOS process. The developed ring hybrid has -3.1 to -3.18 dB through, -5.1 to -5.7 dB coupling, and more than 17 dB isolation and 10 dB return loss across 25-35 GHz while occupying merely 282 x 314 mu m.

引用

页码：798 / 799

页数：2

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