3D nanoprinted high NA ultra-compact catadioptric lens for efficient collection in forward detection configuration microscopy

被引：0
|
作者：
Bertoncini, Andrea [1 ]
Laptenok, Siarhei P. [1 ]
Rajamanickam, Vijayakumar P. [1 ]
Liberale, Carlo [1 ]
机构：
[1] King Abdullah Univ Sci & Technol, Thuwal, Saudi Arabia
来源：
2019 CONFERENCE ON LASERS AND ELECTRO-OPTICS EUROPE & EUROPEAN QUANTUM ELECTRONICS CONFERENCE (CLEO/EUROPE-EQEC) | 2019年
关键词：
D O I：
10.1109/cleoe-eqec.2019.8872142
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页数：1
相关论文
共 50 条
  • [1] 3D Metamaterial for Ultra-Compact Artificial Magnetic Conductor
    Ehrenberg, Isaac M.
    Sarma, Sanjay E.
    Wu, Bae-Ian
    2011 IEEE INTERNATIONAL CONFERENCE ON MICROWAVES, COMMUNICATIONS, ANTENNAS AND ELECTRONIC SYSTEMS (COMCAS 2011), 2011,
  • [2] A Novel 3D Transformer for Ultra-Compact Signal Isolation
    Wu, Rongxiang
    Liao, Niteng
    Fang, Xiangming
    Sin, Johnny K. O.
    2015 IEEE 27TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & IC'S (ISPSD), 2015, : 297 - 300
  • [3] Ultra-Compact, High-Performance, 3D-IPD Integrated using Conformal 3D Interconnects
    Ghannam, Ayad
    Magnani, Alessandro
    Bourrier, David
    Parra, Thierry
    2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018), 2018, : 1082 - 1088
  • [4] MAGIC3D Simulation of an Ultra-compact, Highly Efficient, and High-power Reltron Tube
    Kim, H. J.
    Choi, J. J.
    Lee, B. J.
    Kim, J. Y.
    Lee, J. C.
    IEEE TRANSACTIONS ON DIELECTRICS AND ELECTRICAL INSULATION, 2009, 16 (04) : 961 - 966
  • [5] Ultra-compact 3D measurement module using silica-based PLC
    Katayose, Satomi
    Kurata, Yu
    Watanabe, Kei
    Kasahara, Ryoichi
    Itoh, Mikitaka
    Watanabe, Daichi
    Matsuo, Keigo
    Hanano, Kazunari
    2019 24TH MICROOPTICS CONFERENCE (MOC), 2019, : 84 - 85
  • [6] Folded U-shaped microwire technology for ultra-compact 3D MMICs
    Onodera, K
    Hirano, M
    Toyoda, I
    Tokumitsu, M
    Tokumitsu, T
    1996 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 1996, : 1153 - 1156
  • [7] Embedded High Precision Control and Corn Stand Counting Algorithms for an Ultra-Compact 3D Printed Field Robot
    Kayacan, Erkan
    Zhang, Zhongzhong
    Chowdhary, Girish
    ROBOTICS: SCIENCE AND SYSTEMS XIV, 2018,
  • [8] Ultra-compact structured light projector with all-dielectric metalenses for 3D sensing
    Cheng, J.
    Sun, Xueping
    Zhou, Shun
    Pu, Xinxin
    Xu, Naitao
    Xu, Yingshun
    Liu, Weiguo
    AIP ADVANCES, 2019, 9 (10)
  • [9] Ultra-compact on-chip LED collimation optics by 3D femtosecond direct laser writing
    Thiele, Simon
    Gissibl, Timo
    Giessen, Harald
    Herkommer, Alois M.
    OPTICS LETTERS, 2016, 41 (13) : 3029 - 3032
  • [10] Research on ultra-compact 3D SiC power module for EVs with double layer cooling technology
    Suzuki, Keita
    Yumoto, Takumi
    Bando, Koji
    Endoh, Tetsuo
    Takahashi, Yoshikazu
    2024 IEEE 10TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTC 2024, 2024,
12345