Microstructure and mechanical properties of Sn-Zn-Bi-Cr lead-free solder

被引：18
|
作者：
Luo, Tingbi [1 ]
Hu, Anmin [1 ]
Hu, Jing [1 ]
Li, Ming [1 ]
Mao, Dali [1 ]
机构：
[1] Shanghai Jiao Tong Univ, State Key Lab Met Matrix Composites, Key Lab Thin Film & Microfabricat, Minist Educ,Sch Mat Sci & Engn, Shanghai 200240, Peoples R China
来源：
MICROELECTRONICS RELIABILITY | 2012年 / 52卷 / 03期
基金：
中国国家自然科学基金;
关键词：
TENSILE PROPERTIES;
D O I：
10.1016/j.microrel.2011.10.005
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, the effect of trace addition of Cr on the mechanical properties and reliability on Sn-8Zn-3Bi solder alloys was investigated. It has been demonstrated that the microstructure of solder alloys was refined after doping traces of Cr. The elongation reaches up to 40.63% after doping 0.1% Cr; and the fracture mechanism converts from quasi-cleavage fracture into ductile fracture. With aging time of 0, 4, 9 and 16 days, mechanical property of Sn-8Zn-3Bi-0.3Cr alloy was improved slightly. It was found that the Sn-Zn-Cr phase was increased and Zn in alloy was consumed after aging, so that the amount of primary Zn phase was reduced and microstructure was improved. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码：585 / 588
页数：4
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