Intermetallic phase transformations in Au-Al wire bonds

被引:45
|
作者
Xu, H. [1 ]
Liu, C. [2 ]
Silberschmidt, V. V. [2 ]
Pramana, S. S. [3 ]
White, T. J. [3 ,4 ]
Chen, Z. [3 ]
Acoff, V. L. [1 ]
机构
[1] Univ Alabama, Dept Met & Mat Engn, Tuscaloosa, AL 35487 USA
[2] Univ Loughborough, Wolfson Sch Mech & Mfg Engn, Loughborough LE11 3TU, Leics, England
[3] Nanyang Technol Univ, Sch Mat Sci & Engn, Singapore 639798, Singapore
[4] Australian Natl Univ, Ctr Adv Microscopy, Canberra, ACT 2601, Australia
关键词
Aluminides; Phase transformation; Wire bonding; Microstructure; Electron microscopy; GOLD BALL BONDS; COMPOUND FORMATION; CRYSTAL-STRUCTURE; ALUMINUM; COPPER; GROWTH; DEGRADATION; COUPLES; VOIDS; FILMS;
D O I
10.1016/j.intermet.2011.07.003
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
This paper describes the crystallochemical mechanisms that underpin the migration of nano-size alumina, intermetallic growth and phase transformations in Au-Al wire bonds during annealing from 175 degrees C to 250 degrees C by utilizing high-resolution transmission electron microscopy (HRTEM). Alumina, encapsulated within the Au-Al intermetallic compounds (IMCs), migrates towards the Au ball during annealing, with Au diffusion into the Al pad. The sequence of Au-Al IMC phase development during annealing was investigated. Initially. Au(8)Al(3) appears as a third phase between the Au(4)Al and AuAl(2) layers that form during bonding, and gradually becomes the dominant compound. Both AuAl(2) and Au(8)Al(3) are transformed into the Au-rich alloyAu(4)Al when Al is completely consumed, and this is the terminal product. (C) 2011 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1808 / 1816
页数:9
相关论文
共 50 条
  • [1] Phase transformations in thermally exposed Au-Al ball bonds
    Naren Noolu
    Nikhil Murdeshwar
    Kevin Ely
    John Lippold
    William Baeslack
    Journal of Electronic Materials, 2004, 33 : 340 - 352
  • [2] Phase transformations in thermally exposed Au-Al ball bonds
    Noolu, N
    Murdeshwar, N
    Ely, K
    Lippold, J
    Baeslack, W
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (04) : 340 - 352
  • [3] New mechanisms of void growth in Au-Al wire bonds: Volumetric shrinkage and intermetallic oxidation
    Xu, H.
    Liu, C.
    Silberschmidt, V. V.
    Pramana, S. S.
    White, T. J.
    Chen, Z.
    Acoff, V. L.
    SCRIPTA MATERIALIA, 2011, 65 (07) : 642 - 645
  • [4] Effect of iodine on the corrosion of Au-Al wire bonds
    Verdingovas, Vadimas
    Mueller, Lutz
    Jellesen, Morten Stendahl
    Grumsen, Flemming Bjerg
    Ambat, Rajan
    CORROSION SCIENCE, 2015, 97 : 161 - 171
  • [5] THE EFFECT OF ULTRASONIC FREQUENCY ON INTERMETALLIC REACTIVITY OF AU-AL BONDS
    RAMSEY, TH
    ALFARO, C
    SOLID STATE TECHNOLOGY, 1991, 34 (12) : 37 - 38
  • [6] Investigation of the Palladium Distribution in the Intermetallic Phase Region of Au-Al Wire Bond Interconnects
    Maerz, B.
    Graff, A.
    Klengel, R.
    Petzold, M.
    2012 4TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2012,
  • [7] Influence of intermetallic phases on reliability in thermosonic Au-Al wire bonding
    Mueller, Tobias
    SchrApler, Lutz
    Altmann, Frank
    Kno, Heiko
    Petzold, Matthias
    ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006, : 1266 - +
  • [8] Au-Al solid phase diffusion flip chip bonding - Desirable composition of Au-Al intermetallic compound for stable bonding
    Mori, M
    Kizaki, Y
    Fukuda, Y
    Iida, A
    Saito, M
    1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1998, 3582 : 714 - 719
  • [9] Research on prevention of corrosion at Au-Al bonds
    Shoji, T
    Miyamoto, K
    Shimizu, I
    Ohno, Y
    2001 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2001, 4587 : 492 - 496
  • [10] Intermetallic growth and void formation in Au wire ball bonds to Al pads
    Uno, T
    Tatsumi, K
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1999, 63 (07) : 828 - 837