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- [4] Modeling edge capacitances in ultra-scaled GaAs Schottky barrier diodes for THz applications 2016 COMPOUND SEMICONDUCTOR WEEK (CSW) INCLUDES 28TH INTERNATIONAL CONFERENCE ON INDIUM PHOSPHIDE & RELATED MATERIALS (IPRM) & 43RD INTERNATIONAL SYMPOSIUM ON COMPOUND SEMICONDUCTORS (ISCS), 2016,
- [5] Temperature-Aware Compact Modeling for Resistivity in Ultra-Scaled Cu-Graphene Hybrid Interconnects 24TH IEEE WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI 2020), 2020,
- [6] Atomically Thin Diffusion Barriers for Ultra-Scaled Cu Interconnects Implemented by 2D Materials 2017 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2017,
- [7] Integrating Bottom-Up Approach for Ultra-thin Copper diffusion Barrier Layers in Interconnects 7TH IEEE INTERNATIONAL NANOELECTRONICS CONFERENCE (INEC) 2016, 2016,
- [10] Variability and Reliability in Ultra-Scaled MOS Devices: How Should They Be Evaluated from Nanoscale to Circuit Level ? DIELECTRICS FOR NANOSYSTEMS 4: MATERIALS SCIENCE, PROCESSING, RELIABILITY, AND MANUFACTURING, 2010, 28 (02): : 225 - 236