共 50 条
- [21] High Bandwidth Low Power 2.5D Interconnect Modeling and Design 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1832 - 1837
- [22] From 2D images to 2.5D sprites: A layered approach to modeling 3D scenes IEEE INTERNATIONAL CONFERENCE ON MULTIMEDIA COMPUTING AND SYSTEMS, PROCEEDINGS VOL 1, 1999, : 44 - 50
- [23] 2.5D Morphogenesis: modeling landuse and landcover dynamics in the Ecuadorian Amazon Plant Ecology, 2001, 156 : 75 - 88
- [25] 2.5D Methodologies for Electronic Package and PCB Modeling: Review and Latest Development 2016 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (EMC), 2016, : 801 - 805
- [27] BDLoc: Global Localization from 2.5D Building Map 2021 IEEE INTERNATIONAL SYMPOSIUM ON MIXED AND AUGMENTED REALITY (ISMAR 2021), 2021, : 80 - 89
- [28] Modeling, Simulation and Analysis of Coplanar Waveguide on Glass Substrate for 2.5D Integration 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 564 - 567
- [29] Efficient and Accurate RIE Modeling Methodology for BEOL 2.5D Parasitic Extraction 2014 IEEE 57TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS), 2014, : 519 - 522
- [30] Extrapolation cascadic multigrid method for 2.5D direct current resistivity modeling CHINESE JOURNAL OF GEOPHYSICS-CHINESE EDITION, 2012, 55 (08): : 2769 - 2778