Improving SPC in a wafer fabrication environment

被引：0
|
作者：
Aston, D [1 ]
机构：
[1] Medtron Micro Rel, Tempe, AZ 85281 USA
来源：
TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM | 1998年
关键词：
D O I：
10.1109/IEMT.1998.731092
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Statistical Process Control has been prevalent in American industries since the 1980's. However, following the textbook methodology for a Wafer Fab environment can lead to a system that causes much frustration. Proper SPC usage can be a very delicate issue. There are important issues to be aware of such as dealing with autocorrelated data, trying to control a nonstationary mean, and handling run to run variability versus within run variability. This paper and presentation will outline one facility's approach to reevaluating their SPC program in the Wafer Fab area and ways of approaching these issues.
引用
收藏
页码：346 / 351
页数：2
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