Contact reactive brazing of Al alloy/Cu/stainless steel joints and dissolution behaviors of interlayer

被引：17
|
作者：
Wu Ming-fang [1 ,2 ]
Si Nai-chao [1 ]
Chen Jian [2 ]
机构：
[1] Jiangsu Univ, Sch Mat Sci & Engn, Zhenjiang 212013, Peoples R China
[2] Jiangsu Univ Sci & Technol, Sch Mat Sci & Engn, Zhenjiang 212003, Peoples R China
来源：
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA | 2011年 / 21卷 / 05期
关键词：
Al alloy; stainless steel; contact reactive brazing; microstructure; dissolution of interlayer; ALUMINUM;
D O I：
10.1016/S1003-6326(11)60818-2
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
Contact reactive brazing of 6063 Al alloy and 1Cr18Ni9Ti stainless steel was researched by using Cu as interlayer. Effect of brazing time on microstructure of the joints, as well as the dissolution behaviors of Cu interlayer was analyzed. The results show that the product of reaction zone near 1Cr18Ni9Ti is composed of Fe(2)Al(5), FeAl(3) intermetallic compound (IMC), and Cu-Al IMC; the near by area is composed of Al-Cu eutectic structure with Al (Cu) solid solution. With increasing the brazing time, the thickness of IMC layer at the interface increases, while the width of Al-Cu eutectic structure with Al( Cu) solution decreases. Calculation shows the dissolution rate of Cu interlayer is very fast. The complete dissolution time is about 0.47 s for Cu interlayer with 10 mu m in thickness used in this study.
引用
收藏
页码：1035 / 1039
页数：5
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