Localized heating/bonding techniques in MEMS packaging

被引：2
|
作者：
Mabesa, JR
Scott, AJ
Wu, X
Auner, GW
机构：
来源：
Unmanned Ground Vehicle Technology VII | 2005年 / 5804卷
关键词：
D O I：
10.1117/12.604579
中图分类号：
TP24 [机器人技术];
学科分类号：
080202 ; 1405 ;
摘要：
引用
收藏
页码：700 / 705
页数：6
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