A system level approach to a structured MCM design methodology

The implementation of complex-electronic systems using High Density Packaging (HDP) technologies requires an IC-like "first-time right" design approach, as rework and prototyping for such technologies can be extremely expensive. Highly integrated and versatile MCM design environments, able to provide an automated design data flow and to cope with the required flexibility, are therefore a necessity. Available MCM CAD tools are adaptation of PCB tools, and cannot provide the required features. This paper points out these limitations and outlines a minimum set of features for an optimized MCM design environment. It describes also the development of one such environment, tailored for MCM-D technologies.