共 28 条
- [3] Nanoindentation study of the Pb-free solders in fine pitch interconnects 6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 483 - 489
- [5] A Product Feasibility Study of Assembling Pb-free BGAs in a Eutectic Sn/Pb Process 2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 742 - 751
- [7] Pb-free plating: A process and solder joint reliability study 6TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS (EPTC 2004), 2004, : 162 - 168
- [9] STUDY OF INTERFACIAL REACTION AND ELECTROMIGRATION RELIABILITY OF PB-FREE SOLDERS WITH NICKEL IRON BARRIER LAYER PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1, 2012, : 453 - +
- [10] Wetting performance vs. board finish and flux for several Pb-free solder alloys TWENTY SIXTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, PROCEEDINGS, 2000, : 253 - 262