Mold design and manufacturing using nanocomposite materials

被引:0
|
作者
Han, Ken [1 ]
Rice, Brian [1 ]
机构
[1] Univ Dayton, Res Inst, Dayton, OH 45469 USA
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Composite mold is usually used as a low cost tool in molding processes. The nano-composite molds have many advantages over the traditional low cost composite molds. The nano-composites with 1-inch and 2-inch thickness were made. As the properties of nano-composite materials are quite different from metals, the injection mold design and analysis were carried out based on CAE (computer aided engineer) tool and experiments at UDRI. Major issues in nano-composite mold design were listed and studied. Gate, runner, cooling channel locations and arrangements as well as the nano-composite mold mechanical and thermal performances were analyzed.
引用
收藏
页码:20 / 27
页数:8
相关论文
共 50 条
  • [1] Realization of DFM in Mold Design & Manufacturing
    Jong, Wen Ren
    Lai, Po Jung
    ADVANCED MANUFACTURING TECHNOLOGY, PTS 1-3, 2011, 314-316 : 2293 - 2300
  • [2] DESIGN OF MOLD MATERIALS FOR ENCAPSULATING SEMICONDUCTORS USING EPOXY COMPOUNDS
    Kitaoka, Satoshi
    Kawashima, Naoki
    Maeda, Keiji
    Kuno, Takaki
    Noguchi, Yoshinori
    ADVANCED PROCESSING AND MANUFACTURING TECHNOLOGIES FOR STRUCTURAL AND MULTIFUNCTIONAL MATERIALS, 2008, 28 (07): : 19 - +
  • [3] INTEGRATED MOLD AND DIE DESIGN AND MANUFACTURING SYSTEM
    FUKUOKA, K
    HORIUCHI, K
    FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 1986, 22 (05): : 438 - 450
  • [4] DESIGN AND IMPLEMENT AN ADDITIVE MANUFACTURING INJECTION MOLD
    Alsayyed, Basel
    Foland, Nick
    PROCEEDINGS OF ASME 2022 INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION, IMECE2022, VOL 2A, 2022,
  • [5] Design of mold materials for encapsulating semiconductors using epoxy molding compounds
    Kitaoka, Satoshi
    Kawashima, Naoki
    Maeda, Keiji
    Kuno, Takaki
    Noguchi, Yoshinori
    PRICM 6: SIXTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-3, 2007, 561-565 : 539 - +
  • [6] Manufacturing of nanocomposite structural ceramic materials and coatings
    Gadow, R.
    Kern, F.
    Killinger, A.
    INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY, 2009, 35 (3-4): : 334 - 345
  • [7] Computer aided design and manufacturing of connecting rod mold
    Wang S.
    Qin C.
    Computer-Aided Design and Applications, 2020, 18 (S1): : 65 - 74
  • [8] 3D design from development design, mold design to manufacturing
    Sato, Seiki
    Numada, Muneyoshi
    Morimoto, Taro
    Nihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C, 2008, 74 (12): : 2837 - 2844
  • [9] Additive manufacturing-driven mold design for castings
    Kang, Jinwu
    Shangguan, Haolong
    Deng, Chengyang
    Hu, Yongyi
    Yi, Jihao
    Wang, Xiang
    Zhang, Xiaochuan
    Huang, Tao
    ADDITIVE MANUFACTURING, 2018, 22 : 472 - 478
  • [10] Design of Mold Materials with Excellent Releasability for IC Encapsulation using Epoxy Compounds
    Kitaoka, Satoshi
    Kawashima, Naoki
    Yoshiya, Masato
    Maeda, Keiji
    Kuno, Takaki
    Noguchi, Yoshinori
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 127 - +