Dynamic Characteristics of Printed Circuit Assembly under the Influence of Temperature

被引：0
|
作者：
Kochegarov, Igor I. [1 ]
Tankov, Georgy V. [1 ]
Danilova, Evgeniya [1 ]
机构：
[1] Penza State Univ, Dept Radio Equipment Engn & Prod, Penza, Russia
来源：
PROCEEDINGS OF THE XIX IEEE INTERNATIONAL CONFERENCE ON SOFT COMPUTING AND MEASUREMENTS (SCM 2016) | 2016年
关键词：
Printed board assembly; mechanical influences; mathematical modelling; finite difference method;
D O I：
暂无
中图分类号：
TP301 [理论、方法];
学科分类号：
081202 ;
摘要：
The authors suggest the analytical model for dynamic analysis of the behavior of the board of the printed circuit assembly when influenced by vibration and heat simultaneously. The model was designed to find the movements, acceleration and stresses on the surface of the board.
引用
收藏
页码：131 / 134
页数：4
相关论文
共 50 条
  • [1] Influence of Intermetallic Characteristics on the Solder Joint Strength of Halogen-Free Printed Circuit Board Assembly
    Chang, Hung-Jen
    Chou, Jung-Hua
    Chang, Tao-Chih
    Zhan, Chau-Jie
    Hon, Min-Hsiung
    Hsi, Chi-Shiung
    JOURNAL OF ELECTRONIC PACKAGING, 2011, 133 (02)
  • [2] Dynamic properties analysis and test of SMT printed circuit board assembly
    Xu X.
    Yang P.
    Dong H.
    Wu Y.
    Xu H.
    Zhang L.
    Wang H.
    Wang X.
    International Journal of Materials and Structural Integrity, 2010, 4 (2-4) : 238 - 250
  • [3] Dynamic Analysis of Bare Printed Circuit Board under Impact
    Youssef, Ahmad H.
    Fan, Xuejun
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 810 - 815
  • [4] MECHANIZED ASSEMBLY OF PRINTED CIRCUIT BOARDS
    TOULOUSE, PD
    INSTRUMENT PRACTICE, 1969, 23 (10): : 720 - &
  • [5] Printed circuit assembly with no lead solder assembly process
    Trumble, B
    PROCEEDINGS OF THE 1997 IEEE INTERNATIONAL SYMPOSIUM ON ELECTRONICS AND THE ENVIRONMENT - ISEE-1997, 1997, : 25 - 27
  • [6] Influence of Assembly Tolerance on Dynamic Characteristics of Motor Rotation Assembly
    Lv, Wei Wen
    Jin, Xu Xing
    ENGINEERING SOLUTIONS FOR MANUFACTURING PROCESSES, PTS 1-3, 2013, 655-657 : 608 - 611
  • [7] Component partitioning under demand and capacity uncertainty in printed circuit board assembly
    Lin, WL
    Tardif, V
    INTERNATIONAL JOURNAL OF FLEXIBLE MANUFACTURING SYSTEMS, 1999, 11 (02): : 159 - 176
  • [8] Component Partitioning Under Demand and Capacity Uncertainty in Printed Circuit Board Assembly
    Wei-Liang Lin
    Valerie Tardif
    International Journal of Flexible Manufacturing Systems, 1999, 11 : 159 - 176
  • [9] The Temperature Influence on the Propagation Characteristics of the Signals in the Printed Conductors
    Andreyev, Pavel
    Grishko, Alexey
    Yurkov, Nikolay
    2016 13TH INTERNATIONAL CONFERENCE ON MODERN PROBLEMS OF RADIO ENGINEERING, TELECOMMUNICATIONS AND COMPUTER SCIENCE (TCSET), 2016, : 376 - 378
  • [10] Influence of Increased Voltage on the Characteristics of Printed Circuit Board Protective Coatings
    Hirman, Martin
    Steiner, Frantisek
    Hornak, Jaroslav
    Pihera, Josef
    Rous, Pavel
    2018 INTERNATIONAL CONFERENCE ON DIAGNOSTICS IN ELECTRICAL ENGINEERING (DIAGNOSTIKA), 2018,
12345