Deep dry etching of GaAs and GaSb using Cl2/Ar plasma discharges

Deep dry etch processes for GaAs and GaSb are investigated. Reactive ion etching in Cl-2/Ar plasma discharges is used to pattern GaAs and GaSb with a single-layer soft mask resist. Soft masks have many advantages over (metal) hard masks such as easy and inexpensive processing, low pinhole density, and high etching reproducibility. Using TI35ES, an image reversal resist developed by MicroChemicals, GaAs etch profiles of up to 25 mum depth and GaSb structures of more that 50 mum depth are obtained revealing considerable dimensional stability. Even for etch durations of more than 50 min the resist can be easily removed from the sample surface after the etch process. Roughnesses of etched surfaces of less than 1 nm (rms, measured by atomic force microscopy) are obtained after reactive ion etching for both materials. Photoluminescence measurements reveal that the surface stoichiometry is conserved during the etching step. Deep dry etching of GaAs and GaSb can be exploited for example to fabricate fiber or capillary connections to and between optoelectronic devices or to create substrate windows for backside-illuminated photodetectors in the infrared wavelength range. (C) 2003 American Vacuum Society.