A low cost bumping method for flip chip assembly and MEMS integration

被引：8
|
作者：
Zhang, Jianhua [1 ]
Wang, Changhai
Zeng, Jun
Pang, Ah Ju
机构：
[1] Shanghai Univ, SCh Mechatron & Automat Engn, Shanghai 200072, Peoples R China
[2] Heriot Watt Univ, Sch Engn & Phys Sci, Edinburgh EH14 4AS, Midlothian, Scotland
[3] Genentech Inc, San Francisco, CA 94080 USA
来源：
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2007年 / 30卷 / 04期
基金：
英国工程与自然科学研究理事会;
关键词：
bumping; flexible carrier; flip chip; microelectromechanical systems (MEMS);
D O I：
10.1109/TCAPT.2007.906302
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, we present the development of a low cost chip/wafer bumping technique for flip chip assembly and microelectromechanical systems integration using a bump transfer approach. In this method, high melting temperature bumps such as copper, nickel, and gold bumps are fabricated on a low cost, flexible carrier and then transferred onto the target chip/wafer/board for flip chip assembly. The aluminum pads on test chips were remetallized with electroless nickel and gold layers to facilitate the bonding of bumps to the chips using thermocompression bonding. Parallel bonding and transfer of bumps has been achieved. Thermal cycling and bump shear test showed that reliable bonding was obtained between the bumps and the pads. Surface study using laser ionization mass analysis found no traces of of the polymer carrier on the surface of the bumps on the test chip after the completion of the bump transfer process.
引用
收藏
页码：781 / 786
页数：6
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