Research on Structure and Thermal Analysis of High Power Solid State Power Controller(SSPC)

被引：1
|
作者：
Wang, Kaijun [1 ]
Wang, Li [1 ]
Peng, Meng [1 ]
机构：
[1] Nangjing Univ Aeronaut & Astronaut, Coll Automat Engn, Nanjing, Peoples R China
来源：
2020 IEEE 9TH INTERNATIONAL POWER ELECTRONICS AND MOTION CONTROL CONFERENCE (IPEMC2020-ECCE ASIA) | 2020年
基金：
中国国家自然科学基金;
关键词：
SSPC; structure design; thermal analysis; thermal resistance;
D O I：
10.1109/IPEMC-ECCEAsia48364.2020.9367730
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The structure and thermal analysis of high-power solid-state power controllers (SSPCs) are at the preliminary stage of research at home and abroad. A high-power Multi-chips parallel SSPC layout structure is proposed to improve the current balance and heat dissipation capability. The parasitic inductance is extracted using finite element software, and the circuit simulation model of parasitic inductance is built in Saber. The heat dissipation simulation experiments is performed on the structure to predict the temperature of the SSPC. The simulation results show that the optimized structure can significantly reduce the current imbalance of the parallel devices and improve the cooling effect by optimizing.
引用
收藏
页码：2161 / 2166
页数：6
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