A discussion of vibration and noise issues in a cleanroom design: Past, present, and future

Semiconductor manufacturing processes have evolved dramatically over the past fifteen years or so. Process technologies have migrated from feature sizes of about 10 microns down to 0.25 micron, consistent with the so-called "Moore's Law". Additionally, the increase in wafer size from 200 to 300 mm introduces new issues to be discussed. Vibration and noise are two important contaminants affecting semiconductor production processes. As vibration and noise consultants to this industry for the past several decades, we are challenged almost daily with questions such as: "What are the vibration requirements for the environments which are to house the present and future generation submicron processes?" "What are the requirements for the 300 mm conversion?" In this paper, we review the process tool vibration requirements in the past, the present, and the future. We discuss vibration criteria which will need to apply to future fabrication facilities to accommodate these tools. We will elaborate on concepts which may need to be considered in the design of future facilities for yet-to-be-defined future technologies.