Mechanism of cutting edge chipping and its suppression in diamond turning of copper

被引：22

作者：

Tanaka, H ^{[1
]}

Shimada, S

Higuchi, M

Yamaguchi, T

Kaneeda, T

Obata, K

机构：

[1] Osaka Electrocommun Univ, Neyagawa, Osaka, Japan

[2] Kansai Univ, Suita, Osaka, Japan

[3] Okayama Univ Sci, Okayama, Japan

[4] ALMT Diamond Corp, Takino, Hyogo, Japan

来源：

CIRP ANNALS-MANUFACTURING TECHNOLOGY | 2005年 / 54卷 / 01期

关键词：

turning; diamond; cutting edge chipping;

D O I：

10.1016/S0007-8506(07)60047-X

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper investigates the mechanism of cutting edge chipping in diamond turning of copper in terms of the change in Hertzian strength of diamond specimens subjected to thermal histories. The study suggests that the strength of diamond decreases as the result of the propagation of existing surface micro cracks caused by the thermo-chemical erosion of oxygen at the crack tips. The catalytic reaction involving copper is also shown to accelerate the crack propagation. Then, a cutting technique of reduced oxygen atmosphere is proposed to suppress the cutting edge chipping in diamond turning of copper over an extended cutting time.

引用

页码：51 / 54

页数：4

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